ROBUST, HIGH-THERMAL CONDUCTANCE, CAPILLARITY-ENABLED THIN-FILM DRY CONDENSING SURFACES
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United States of America Patent
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Jul 18, 2024
app pub date -
May 17, 2022
filing date -
May 17, 2021
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Enhancing condensation heat transfer performance in applications including power generation, thermal management of high-performance electronics, water purification, distillation, natural gas processing, and air conditioning can be achieved with heat transfer devices. Condensation heat transfer can be enhanced via a hierarchical structure attached on a condenser surface. This novel hierarchical structure is composed of a thin, highly permeable, thermally conductive porous wick and a highly porous, robust, intrinsically hydrophobic membrane bonded or attached on top of the wick.
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