PRODUCTION METHOD FOR CIRCUIT BOARD ASSEMBLY

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United States of America Patent

APP PUB NO 20240237227A1
SERIAL NO

18601170

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Abstract

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Provided is a method for producing a circuit board assembly, including connecting a lithium ion secondary battery to a circuit board by reflow soldering, wherein the lithium ion secondary battery has been subjected to at least initial charging and discharging, and the lithium ion secondary battery has a state of charge (SOC) of 0 to 29% during reflow soldering.

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Patent Owner(s)

Patent OwnerAddress
NGK INSULATORS LTD2-56 SUDA-CHO MIZUHO-KU NAGOYA-SHI AICHI-PREFECTURE 467-8530

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
MIZUKAMI, Shunsuke Nagoya-City, JP 29 771
NAKASHIMA, Eiji Nagoya-City, JP 15 42
OTSUKA, Haruo Ichinomiya-City, JP 18 230
TANAKA, Yuki Nagoya-City, JP 209 768
YURA, Yukinobu Nagoya-City, JP 60 300

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