SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
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United States of America Patent
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Issued Date -
Jul 11, 2024
app pub date -
Mar 26, 2024
filing date -
Oct 1, 2021
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Abstract
A semiconductor device according to the present invention is provided with: a semiconductor element which has an element front surface, an element back surface, and an element lateral surface; a conductive part that is arranged in a position where the conductive part faces the element back surface, and has a wiring part on which the semiconductor element is mounted; and a sealing resin which seals the semiconductor element and the conductive part. The wiring part has a wiring front surface that faces the element back surface, and a wiring back surface. The conductive part has a terminal part which extends from the wiring back surface in a direction that is opposite to the semiconductor element. The sealing resin covers the element back surface, the element lateral surface and the wiring front surface. The element front surface is exposed without being covered by the sealing resin.
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