SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
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United States of America Patent
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Issued Date -
Jul 11, 2024
app pub date -
Mar 21, 2024
filing date -
Sep 28, 2021
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Abstract
According to one embodiment of the present disclosure, a substrate processing apparatus includes a rotor that holds and rotates a substrate, a first processing liquid supply unit that supplies a first processing liquid for etching to a processing target surface of the substrate that is being rotated by the rotor, thereby etching the processing target surface of the substrate, and a second processing liquid supply unit that supplies a second processing liquid for oxidation to the processing target surface of the substrate that is being rotated by the rotor, thereby forming an oxide film, consecutively to the etching by the supplying of the first processing liquid.
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