POLISHING PAD AND POLISHING METHOD
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United States of America
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Issued Date -
Apr 25, 2024
app pub date -
Feb 25, 2022
filing date -
Feb 25, 2022
priority date (Note) -
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Abstract
Provided is a polishing pad having a high following performance even when a surface to be polished is a curved face. A polishing pad (1) in an embodiment of the present invention includes a polishing layer (2) having a polishing face (21) and a support layer (3) that is formed from a material softer than the polishing layer (2) and is fixed to a face (22) opposite to the polishing face (21) of the polishing layer (2). The support layer (3) has a hardness of not less than 30 and less than 70 in terms of F hardness.
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