SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING SEMICONDUCTOR STRUCTURE

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United States of America Patent

APP PUB NO 20240224490A1
SERIAL NO

18403713

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Semiconductor structure and forming method thereof are provided. The semiconductor structure includes a substrate and a plurality of transistors located over the substrate. A transistor of the plurality of transistors includes: a channel layer parallel to a substrate surface, a gate structure surrounding the channel layer, and a source/drain doped region located on two sides of the gate structure. The source/drain doped region is in contact with the channel layer, and the gate structure is electrically isolated from the source/drain doped region. The semiconductor structure also includes a first metal structure located over the substrate, and a second metal structure located over the first metal structure and the gate structure. The first metal structure is in contact with the source/drain doped region. The first metal structure, the source/drain doped region and the gate structure are arranged along a first direction. The first direction is parallel to the substrate surface.

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Patent Owner(s)

Patent OwnerAddress
SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION18 ZHANGJIANG ROAD PUDONG NEW AREA SHANGHAI 201203

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
SU, Bo Shanghai, CN 54 729
ZHANG, Yijun Shanghai, CN 11 16

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