CIRCUIT BOARD
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United States of America Patent
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Issued Date -
Jul 4, 2024
app pub date -
Jun 8, 2023
filing date -
Dec 30, 2022
priority date (Note) -
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Abstract
A circuit board includes a substrate and a first metal circuit layer. The substrate has an upper surface and a lower surface opposite to the upper surface. The first metal circuit layer is located on the upper surface, and the first metal circuit layer includes a first line area and a second line area. The first line area and the second line area are separated by a groove area, and the groove area includes a bent section. Accordingly, the risk of detachment between the first metal circuit layer and the substrate due to stress concentration on the circuit board can be reduced.
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