MODULE WITH HIGH PEAK BANDWIDTH I/O CHANNELS

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United States of America Patent

APP PUB NO 20240223283A1
SERIAL NO

18429960

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A high peak bandwidth I/O channel embedded within a multilayer surface interface that forms the bus circuitry electrically interfacing the output or input port on a first semiconductor die with the input or output port on a second semiconductor die.

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Patent Owner(s)

Patent OwnerAddress
DE ROCHEMONT L PIERREAUSTIN TEXAS 78753

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
de, Rochemont L Pierre Horseshoe Bay, US 66 1175

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