SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF

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United States of America Patent

APP PUB NO 20240222486A1
SERIAL NO

18523222

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A semiconductor structure includes a substrate, channel layers arranged in parallel along a first direction, gate structures arranged in parallel along a second direction, source doped regions and drain doped regions located on two sides of the gate structures respectively, and a metal layer. The gate structures surround the channel layers, respectively. The first and second directions are parallel to a substrate surface and perpendicular to each other. The source and drain doped regions contact the channel layers, respectively. The metal layer contacts one of the source or drain doped regions. The metal layer, one of the source doped regions, one of the drain doped regions, and one of the gate structures are stacked along the second direction.

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Patent Owner(s)

Patent OwnerAddress
SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION18 ZHANGJIANG ROAD PUDONG NEW AREA SHANGHAI 201203

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
SU, Bo Shanghai, CN 54 729
ZHANG, Yijun Shanghai, CN 11 16

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