ETCHING PLATINUM-CONTAINING THIN FILM USING PROTECTIVE CAP LAYER
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United States of America Patent
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Issued Date -
Jul 4, 2024
app pub date -
Jan 31, 2024
filing date -
Jan 19, 2017
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Abstract
A microelectronic device includes a substrate a platinum-containing layer over the substrate. The platinum-containing layer includes a first segment and a second segment adjacent to the first segment, and has a first surface and a second surface opposite the first surface closer to the substrate than the first surface. A first spacing between the first segment and the second segment at the first surface is greater than a second spacing between the first segment and the second segment at the second surface. A width of the first segment along the first surface is less than twice a thickness of the first segment, and the second spacing is less than twice the thickness of the first segment.
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