SEMICONDUCTOR DEVICE HAVING CONTACT PLUG
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United States of America Patent
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Issued Date -
Jul 4, 2024
app pub date -
Oct 10, 2023
filing date -
Dec 29, 2022
priority date (Note) -
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status (Latency Note)
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Abstract
An apparatus that includes a first interlayer insulating film having a contact hole; a contact plug embedded in the contact hole, the contact plug including a main part and a barrier metal part located between an outer wall of the main part and an inner wall of the contact hole; a second interlayer insulating film covering the first interlayer insulating film; and a first conductive pattern embedded in the second interlayer insulating film and connected to the contact plug. Apart of the second interlayer insulating film is embedded in a gap between a top part of the outer wall of the main part of the contact plug and a top part of the inner wall of the contact hole.
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