SUBSTRATE TREATMENT SYSTEM AND SUBSTRATE TREATMENT METHOD

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United States of America Patent

APP PUB NO 20240222171A1
SERIAL NO

18542665

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Abstract

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Proposed are a substrate treatment system and a substrate treatment method. More particularly, a technology capable of realizing a fine etching adjustment and capable of increasing a Unit Per Equipment Hour (UPEH) by reducing time required for a process is provided.

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Patent Owner(s)

Patent OwnerAddress
SEMES CO LTD77 4SANDAN 5-GIL JIKSAN-EUP SEOBUK-GU CHEONAN-SI CHUNGCHEONGNAM-DO

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
CHOI, Sung Min Osan-si, KR 51 352
HONG, Jin Hee Hwaseong-si, KR 9 1
JANG, Dong Young Seongnam-si, KR 14 19
JEON, Min Sung Osan-si, KR 12 25
JEON, Young Eun Ulsan-si, KR 8 1
JIN, Young Jo Hwaseong-si, KR 5 1
KIM, Yun Sang Seongnam-si, KR 32 24
LEE, Tae Hwan Cheonan-si, KR 9 24

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