ENABLING COPPER RECESS FLATTENING THROUGH A DFR PATTERNING PROCESSES
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United States of America Patent
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Issued Date -
Jul 4, 2024
app pub date -
Dec 29, 2022
filing date -
Dec 29, 2022
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Abstract
Embodiments disclosed herein include electronic packages and methods of forming electronic packages. In an embodiment, the electronic package comprises a core, where the core comprises glass. In an embodiment, a through glass via (TGV) is provided through a thickness of the core, where a top surface of the TGV is not coplanar with a top surface of the core. In an embodiment, the electronic package further comprises a ridge on the top surface of the TGV, where the ridge is symmetric about a centerline of the TGV.
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