ENABLING COPPER RECESS FLATTENING THROUGH BLOCKED COPPER ETCHING PROCESSES
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United States of America Patent
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Issued Date -
Jul 4, 2024
app pub date -
Dec 29, 2022
filing date -
Dec 29, 2022
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Abstract
Embodiments disclosed herein include electronic packages and methods of forming electronic packages. In an embodiment, an electronic package comprises a core, where the core comprises glass. In an embodiment, a through glass via (TGV) is provided through a thickness of the core. In an embodiment, the TGV comprises a top surface that is non-planar and includes a symmetric ridge on the non-planar top surface.
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