SUBSTRATE PROCESSING METHOD, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING APPARATUS AND NON-TRANSITORY COMPUTER-READABLE RECORDING MEDIUM
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United States of America Patent
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Issued Date -
Jul 4, 2024
app pub date -
Jan 31, 2024
filing date -
Sep 14, 2021
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Abstract
A technique is provided to perform: (a) forming a first film exerting a predetermined adhesive force on an inner surface of a concave structure formed on a surface of a substrate by supplying a first source gas to the substrate; and (b) forming a second film exerting an adhesive force smaller than that of the first film on the first film by supplying a second source gas to the substrate.
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