MULTILAYER ELECTRONIC COMPONENT
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United States of America Patent
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Issued Date -
Jul 4, 2024
app pub date -
Dec 13, 2023
filing date -
Dec 29, 2022
priority date (Note) -
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Abstract
A multilayer electronic component includes a capacitance formation portion where the first and second internal electrodes overlap each other in a first direction, a first margin portion disposed on one side surface or the other side surface of the capacitance formation portion in a second direction and including one end of the first or second internal electrode. A dielectric layer includes a first region disposed at a center region of the dielectric layer included in the capacitance formation portion, and a second region included in the first margin portion. At least one element of Mg, Si, Al, Li, Cu, Na, Bi, Mn, Cr, V, Fe, Ni, Co, Sn, In, Ga, Zn, Pb, Ag, Pd, Pt, Ir, Ru, Os, Y, Er, Yb, Tb, Ho, Dy is included in the second region, and not substantially included in the first region.
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