ETCH-FREE PHOTORESIST PATTERNING IN MULTI-DEPTH NANOWELLS
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United States of America Patent
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Issued Date -
Jul 4, 2024
app pub date -
Dec 5, 2023
filing date -
Dec 7, 2022
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Abstract
Examples of flow cells include substrates. Embodiments of the present disclosure also relate to methods of fabricating flow cell substrates. Some example workflows exploit light blocking properties of an imprint layer such that the process does not include etch steps. Such processes may be used to create substrates compatible with simultaneous paired-end sequencing methods.
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