THICKNESS MEASUREMENT METHOD, THICKNESS MEASUREMENT DEVICE, DEFECT DETECTION METHOD, AND DEFECT DETECTION DEVICE
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United States of America Patent
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Issued Date -
Jul 4, 2024
app pub date -
Mar 11, 2024
filing date -
Feb 6, 2019
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Abstract
A thickness measurement method includes: heating a surface of the measurement object in a dot shape by a heating device; generating a thermal image corresponding to a temperature of the surface of the measurement object by capturing an image of the heated surface of the measurement object at a predetermined time interval by an imaging device; acquiring temperature data indicating temporal changes in temperature at multiple positions on the surface of the measurement object based on the thermal image generated by the imaging device; fitting a solution function indicating a solution of a heat conduction equation corresponding to a point heat source and including a parameter related to the thickness of the measurement object to the temperature data; and calculating the thickness of the measurement object based on a value of the parameter in the fitted solution function.
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