Fabric Substrate and Manufacturing Method Thereof

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United States of America Patent

APP PUB NO 20240218592A1
SERIAL NO

18610450

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Abstract

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According to the present invention, there is provided a fabric substrate for mounting a light emitting element. The fabric substrate comprises a fabric layer including at least one fabric, a stress buffer layer that is disposed on the fabric layer and minimizes an occurrence of physical strain and stress caused by bending the fabric layer, and a flattening layer that is disposed on the stress buffer layer and provides a flat surface to allow a light emitting element to operate.

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Patent Owner(s)

Patent OwnerAddress
KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY291 DAEHAK-RO YUSEONG-GU DAEJEON 34141

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Choi, Kyung Cheol Daejeon, KR 16 36
Choi, Seung Yeop Daejeon, KR 2 0
Kwon, Seon Il Daejeon, KR 2 0

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