METHOD FOR SMOOTHING SURFACE OF COPPER FOIL AND COPPER FOIL OBTAINED

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United States of America Patent

APP PUB NO 20240218554A1
SERIAL NO

18182365

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Abstract

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A method for smoothing surfaces of a copper foil and the copper foil obtained are provided, wherein the method for smoothing surfaces of the copper foil includes the following steps. Supplied with a copper foil. A first electropolishing process is performed on the copper foil. The copper foil is subjected to a pickling process. A second electropolishing process is performed on the copper foil.

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Patent Owner(s)

Patent OwnerAddress
NAN YA PLASTICS CORPORATIONTAIPEI

International Classification(s)

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  • 2023 Application Filing Year
  • C23G Class
  • 20 Applications Filed
  • 4 Patents Issued To-Date
  • 20 % Issued To-Date
Click to zoom InYear of Issuance% of Matters IssuedCumulative IssuancesYearly Issuances2023202420250255075100

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Cheng, Wei-Sheng TAIPEI, TW 21 7
Liao, Te-Chao TAIPEI, TW 380 152
Wu, Chao-Tung TAIPEI, TW 11 3

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Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges58101 - 1002.557.51012.51517.52022.52527.53032.53537.54042.54547.55052.55557.56062.5

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