SOLID OXIDE CELL STACK COMPRISING INTEGRATED INTERCONNECT, SPACER AND MANIFOLD
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United States of America Patent
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Issued Date -
Jul 4, 2024
app pub date -
Feb 8, 2022
filing date -
May 3, 2021
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Abstract
A Solid Oxide Cell stack has an integrated interconnect, spacer and manifold, which is formed by bending a surplus part of the plate interconnect 180° to form a spacer part on top of the interconnect and connected to the interconnect at least by the bend and comprising overlapping primary and secondary gas inlet openings in adjacent layers in fluid connection.
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