MOISTURE-CURABLE HOT-MELT ADHESIVE COMPOSITION AND USE THEREOF
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United States of America Patent
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Issued Date -
Jul 4, 2024
app pub date -
Nov 3, 2023
filing date -
Dec 30, 2022
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Abstract
A moisture-curable hot-melt adhesive composition comprises a polymer obtained by reacting the following components: 20 wt % to 60 wt % of bio-based polyester polyol; 1 wt % to 30 wt % of polycaprolactone polyol; 5 wt % to 50 wt % of petroleum-based polyester polyol; and 15 wt % to 25 wt % of polyisocyanate; wherein the bio-based polyester polyol comprises a product of a dicarboxylic acid derived from biomass and a diol derived from biomass or petroleum; and the dicarboxylic acid is sebacic acid, succinic acid, or a combination thereof. A use of the aforesaid moisture-curable hot-melt adhesive composition is also provided.
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