METHOD FOR MANUFACTURING PACKAGE STRUCTURE
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United States of America Patent
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N/A
Issued Date -
Jul 4, 2024
app pub date -
Mar 19, 2024
filing date -
Dec 14, 2020
priority date (Note) -
Published
status (Latency Note)
Importance
Abstract
A method for manufacturing package structure is provided, including: providing a substrate having recesses; forming first MEMS chips on the substrate, each with a through-substrate via, and a first sensor or microactuator on the lower surface, located in one of the recesses; forming first intermediate chips on the substrate, each respectively on one of the first MEMS chips, having a through-substrate via, and including a signal conversion unit, a logic operation unit, control unit, or a combination thereof; forming second MEMS chips on the first intermediate chips, each with a through-substrate via, having a second sensor or microactuator on its upper surface, wherein the package structure includes at least one of the first sensor and the second sensor; and forming first capping plates on the second MEMS chips, each providing a receiving space for the second sensor or microactuator on the upper surface of each second MEMS chip.
First Claim
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