DEVICE MODULE
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United States of America Patent
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Issued Date -
Jul 4, 2024
app pub date -
Mar 11, 2022
filing date -
Mar 15, 2021
priority date (Note) -
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status (Latency Note)
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Abstract
One aim is to provide a technique allowing a device to be cooled without being housed inside a duct. A device module includes: a support member that is disposed in a roof inner space that is located between a roof panel and an interior member in a vehicle; and a device that is supported by a support surface among outer surfaces of the support member. A support-member-side flow path is formed inside the support member, and the support-member-side flow path is connected to a duct-side flow path in a duct in the vehicle.
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