DENSIFIED WOOD INCLUDING PROCESS FOR PREPARATION
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United States of America Patent
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Issued Date -
Jul 4, 2024
app pub date -
Mar 18, 2024
filing date -
Dec 29, 2017
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Abstract
A wood substrate or member is included, having an increased density with respect to natural, untreated wood. The process includes drying the wood prior to application of heat and pressure, which are controlled to reduce or eliminate color change on a surface of the wood member where heat and pressure are applied.
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