METHOD FOR INTEGRATING SEMICONDUCTOR CHIPS ON A SUBSTRATE
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United States of America Patent
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Issued Date -
Jun 27, 2024
app pub date -
Dec 22, 2022
filing date -
Dec 22, 2022
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Abstract
A method for transferring microLEDs from a growth wafer to a display substrate is disclosed. MicroLEDs on the growth wafer are bonded to an adhesive layer on a transparent carrier coated with a light-absorbing layer. After aligning the carrier to a display substrate, the transparent carrier is exposed to light pulses from a flashlamp to heat the light-absorbing layer in order to separate the adhesive layer for the purpose of transferring the microLEDs onto the display substrate. MicroLEDs may be bonded to the display substrate prior to or after transfer to the display substrate. Bonding of the microLEDs to the display substrate, such as soldering, may also be performed with light pulses from the flashlamp by exposing the transparent carrier to heat the light-absorbing layer and the adjacent microLEDs to heat them and bond them to the display substrate.
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