INFO PACKAGES INCLUDING THERMAL DISSIPATION BLOCKS
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United States of America Patent
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Issued Date -
Jun 27, 2024
app pub date -
Mar 12, 2024
filing date -
Aug 6, 2021
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status (Latency Note)
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Abstract
A method of forming a semiconductor device includes forming a first interconnect structure over a carrier; forming a thermal dissipation block over the carrier; forming metal posts over the first interconnect structure; attaching a first integrated circuit die over the first interconnect structure and the thermal dissipation block; removing the carrier; attaching a semiconductor package to the first interconnect structure and the thermal dissipation block using first electrical connectors and thermal dissipation connectors; and forming external electrical connectors, the external electrical connectors being configured to transmit each external electrical connection into the semiconductor device, the thermal dissipation block being electrically isolated from each external electrical connection.
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