DEVICE AND METHOD FOR BONDING OF SUBSTRATES
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United States of America Patent
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Issued Date -
Jun 27, 2024
app pub date -
Mar 6, 2024
filing date -
Mar 22, 2016
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Abstract
A method and a corresponding device for bonding a first substrate with a second substrate at mutually facing contact faces of the substrates. The method includes holding of the first substrate to a first holding surface of a first holding device and holding of the second substrate to a second holding surface of a second holding device. A change in curvature of the contact face of the first substrate and/or a change in curvature of the contact face of the second substrate are controlled during the bonding.
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