System and Method for Plasma Processing
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United States of America Patent
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Jun 27, 2024
app pub date -
Dec 23, 2022
filing date -
Dec 23, 2022
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Abstract
An apparatus for plasma processing includes an RF power source and a set of resonating structures coupled to the RF power source. The resonating structures include a first region and a second region adjacent to the second region. The first region includes a first antenna and a first coupling circuit, the first coupling circuit being outside a coupling of the RF power source to the first region, where the first coupling circuit is configured to adjust a power distribution of the first region. The second region includes a second antenna.
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