PLASMA PROCESSING APPARATUS AND METHOD
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United States of America Patent
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Issued Date -
Jun 27, 2024
app pub date -
Mar 4, 2024
filing date -
Mar 26, 2021
priority date (Note) -
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Abstract
A plasma processing apparatus for semiconductor processing includes an injector holder configured to removably mate with a structure defining an interior chamber of a plasma processing apparatus. The injector holder defines a first opening. A sleeve is configured to be received within the first opening, and the sleeve defines a second opening. A gas injector is configured to be received within the second opening of the sleeve.
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