CHIP RESISTOR

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United States of America Patent

APP PUB NO 20240212890A1
SERIAL NO

18594657

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Abstract

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A chip resistor includes an insulating substrate, a first electrode, a second electrode, a resistor, a first heat transfer layer, a second heat transfer layer, and an insulating protective layer. The first heat transfer layer has a thermal conductivity greater than that of the insulating protective layer, and is in contact with the resistor and a first front electrode. The second heat transfer layer is separated from the first heat transfer layer. The second heat transfer layer has a thermal conductivity greater than that of the insulating protective layer, and is in contact with the resistor and a second front electrode.

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Patent Owner(s)

Patent OwnerAddress
ROHM CO LTD21 SAIIN MIZOSAKI-CHO UKYO-KU KYOTO-SHI KYOTO 6158585 ?6158585

International Classification(s)

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  • 2024 Application Filing Year
  • H01C Class
  • 77 Applications Filed
  • 2 Patents Issued To-Date
  • 2.60 % Issued To-Date
Click to zoom InYear of Issuance% of Matters IssuedCumulative IssuancesYearly Issuances202420250255075100

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
SHINOURA, Takanori Kyoto-shi, JP 13 28

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Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges244901 - 10020406080100120140160180200220240260

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