SUBSTRATE PROCESSING APPARATUS WITH CAPABILITIES OF AUTOMATIC DEVICE CONFIGURATION AND A METHOD THEREOF
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United States of America Patent
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Issued Date -
Jun 27, 2024
app pub date -
Dec 21, 2023
filing date -
Dec 23, 2022
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Abstract
A semiconductor processing apparatus is presented. The apparatus comprising a plurality of process modules, each of them configured to process wafers, and wherein each of the plurality of process modules comprising a plurality of slaves configured to receive and process wafers and a control unit comprising a processor and a memory and the control unit communicably connected to the plurality of slaves in series or in parallel, the control unit configured to configure and control the plurality of slaves, wherein the processor is configured to read at least one configuration data file from the memory, generate at least one configuration file of the status of the plurality of slaves based on the at least one configuration data file, enable/disable the plurality of slaves according to the generated at least one configuration file, and load applications to control the plurality of slaves.
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