METHOD FOR PRODUCING AN ELECTRODEPOSITED COPPER FOIL AND COPPER FOIL OBTAINED THEREWITH
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United States of America Patent
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Issued Date -
Jun 27, 2024
app pub date -
May 6, 2022
filing date -
May 7, 2021
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Abstract
A method for producing an electrodeposited copper foil with a matte side having a Rz ISO of 0.8 μm or less, the electrodeposited copper foil being continuously formed in an electroforming cell including a rotating drum-shaped cathode, a stationary anode and an electrolyte. The electrolyte comprises: copper, preferably in the form of copper ions, at a concentration of at least 60 g/L; a halogen ion at a concentration composed of between 30 and 50 ppm; 3-mercapto-1-propane sulfonate at a concentration composed of between 5 and 15 ppm; a nitrogen-containing polymer leveler at a concentration composed of between 5 and 12 ppm, the nitrogen-containing polymer leveler having an average molecular weight Mw composed of between 1 000 and 30 000 g/mol; and a polyether suppressor at a concentration composed of between 15 and 30 ppm, the polyether suppressor having an average molecular weight Mw composed of between 500 and 12 000 g/mol.
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