MICROMIRROR CHIP PACKAGE STRUCTURE, LASER DEVICE, AND VEHICLE
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United States of America Patent
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Issued Date -
Jun 27, 2024
app pub date -
Mar 8, 2024
filing date -
Sep 10, 2021
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Abstract
Embodiments of this application provide a micromirror chip package structure. The micromirror chip package structure includes a micromirror chip, and a first substrate and a second substrate that are stacked, where the micromirror chip is disposed on a side that is of the first substrate and that faces away from the second substrate, where the micromirror chip includes a frame, a movable component, and a first torsion arm, and the movable component is connected to the frame through the first torsion arm; the first substrate includes a vibration isolation platform, an elastic beam, and a support frame, the micromirror chip is disposed on the vibration isolation platform, and the vibration isolation platform is connected to the support frame through the elastic beam; the support frame is fastened to the second substrate, and a gap is formed between the vibration isolation platform and the second substrate.
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