FORMING METHOD, FORMING APPARATUS, AND ARTICLE MANUFACTURING METHOD
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United States of America Patent
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Issued Date -
Jun 27, 2024
app pub date -
Dec 13, 2023
filing date -
Dec 26, 2022
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Abstract
The present invention provides a forming method of forming a composition on an underlying film of a substrate by using a mold, the method including: detecting, as an index indicating a state of the underlying film, at least one of an intensity and a wavelength of reflected light obtained from the substrate by irradiating the substrate with light; determining, based on the detected index, a measurement condition for measuring a position of a mark of the substrate; bringing the mold and the composition on the substrate into contact with each other; and measuring, after the bringing, in a contact state in which the mold and the composition are in contact with each other, the position of the mark of the substrate under the determined measurement condition, wherein the detecting is performed before the bringing.
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