APPARATUS AND METHOD FOR MOUNTING COMPONENT
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United States of America Patent
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Issued Date -
Jun 20, 2024
app pub date -
Mar 4, 2024
filing date -
Mar 4, 2024
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Abstract
An apparatus for mounting a component includes: a head including a nozzle and a substrate recognition camera; a first correction camera generating a first image by capturing an image of a component adsorbed to the nozzle and disposed at a first height; a second correction camera generating a second image by capturing an image of the component adsorbed to the nozzle and disposed at a second height; and a controller obtaining a mounting offset of the component by comparing the first image and the second image with each other and controlling the head so that the component is mounted on the substrate in a state in which the mounting offset is applied.
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