LIGHT-EMITTING DIODE ARRAY WITH PRECISE POSITION ASSEMBLY FOR AUTOMOTIVE HEADLIGHT APPLICATIONS
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United States of America Patent
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Issued Date -
Jun 20, 2024
app pub date -
Nov 20, 2023
filing date -
Nov 20, 2023
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Abstract
A method for enabling self-aligning light-emitting diodes is provided. The method includes printing a die architecture including solders having a bond line thickness according to a printed circuit board design and placing light-emitting diodes in corresponding placement positions onto the solders. The method includes implementing a reflow process that includes a self-alignment effect for the light-emitting diodes. The self-alignment effect comprises creating surface tension forces while the solders are molten that pull or hold the light-emitting diodes to or at final positions.
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