SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

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United States of America Patent

APP PUB NO 20240204054A1
SERIAL NO

18589893

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Abstract

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Disclosed are semiconductor devices and/or method of fabricating the same. The semiconductor device comprises a substrate including first and second regions, a first active pattern on the first region and including a pair of first source/drain patterns and a first channel pattern including first semiconductor patterns, a second active pattern on the second region and including a pair of second source/drain patterns and a second channel pattern including second semiconductor patterns, a support pattern between two vertically adjacent first semiconductor patterns, and a first gate electrode and a second gate electrode on the first channel pattern and the second channel pattern. A channel length of the first channel pattern is greater than that of the second channel pattern. A ratio of a width of the support pattern to the channel length of the first channel pattern is in a range of 0.05 to 0.2.

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Patent Owner(s)

Patent OwnerAddress
SAMSUNG ELECTRONICS CO LTDREPUBLIC OF KOREA

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
BAE, Dong Il Seongnam-si, KR 43 182
PARK, Beomjin Hwaseong-si, KR 33 18
PARK, Noh Yeong Suwon-si, KR 4 1

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