AMPLIFIER MODULES AND SYSTEMS WITH GROUND TERMINALS ADJACENT TO POWER AMPLIFIER DIE
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United States of America Patent
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Issued Date -
Jun 20, 2024
app pub date -
Dec 19, 2022
filing date -
Dec 19, 2022
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Abstract
An amplifier module includes a module substrate with a mounting surface, and a thermal dissipation structure that extends through the module substrate. A ground contact of a power transistor die is coupled to a surface of the thermal dissipation structure. Encapsulant material covers the mounting surface of the module substrate and the power transistor die, and a surface of the encapsulant material defines a contact surface of the amplifier module. A ground terminal is embedded within the encapsulant material. The ground terminal has a proximal end coupled to the thermal dissipation structure, and a distal end exposed at the contact surface. The ground terminal is electrically coupled to the ground contact of the power transistor die through the thermal dissipation structure.
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