METHOD OF PRODUCING ELECTRONIC COMPONENTS, CORRESPONDING ELECTRONIC COMPONENT
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United States of America Patent
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Issued Date -
Jun 20, 2024
app pub date -
Mar 4, 2024
filing date -
Mar 4, 2024
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Abstract
A method of producing electronic components including at least one circuit having coupled therewith electrical connections including metallic wire bondable surfaces encased in a packaging, the method including bonding stud bumps, in particular copper stud bumps, at determined areas of said wire bondable surfaces.
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