ENGINEERED SEMICONDUCTOR SUBSTRATE
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United States of America Patent
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Issued Date -
Jun 20, 2024
app pub date -
Nov 20, 2023
filing date -
Nov 20, 2023
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Abstract
A semiconductor device assembly is provided. The semiconductive device assembly includes a semiconductor die with a substrate having an engineered portion and a semiconductive portion. The engineered portion includes one or more of: a sintered material, a corrugated material, oriented strands of material compressed to form a solid structure, layers of material compressed to form a solid structure, or a material arranged to form one or more planar trusses. The semiconductive portion is adhered directly to the engineered portion. A layer of dielectric material is disposed at the semiconductive portion, and circuitry is disposed at the layer of dielectric material. In doing so, a cost-efficient and mechanically robust semiconductor device may be assembled.
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