METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
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United States of America Patent
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Jun 20, 2024
app pub date -
Nov 14, 2023
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Nov 14, 2023
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Abstract
A method for manufacturing a semiconductor device, the method including forming a stack on a wafer, wherein the stack includes a plurality of layers of the stack, forming a photoresist pattern on the stack, determining whether a material of at least one layer among the plurality of layers of the stack has changed and whether at least one process among a plurality of processes for forming the plurality of layers of the stack has changed, changing a first wavelength for overlay measurement upon determination that the material of the at least one layer or the at least one process has changed, and measuring an overlay using the changed first wavelength for overlay measurement.
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