SUBSTRATE TREATING APPARATUS AND SUBSTRATE TREATING SYSTEM INCLUDING THE SAME
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United States of America Patent
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Issued Date -
Jun 20, 2024
app pub date -
Dec 20, 2023
filing date -
Dec 20, 2023
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Abstract
There are provided a substrate treating apparatus and method for etch rate deviation improvement. The substrate treating apparatus includes: a treating bath providing space for receiving a substrate treating solution for treating substrates; a treating solution source providing the substrate treating solution into the treating bath such that the substrates are immersed and treated in the substrate treating solution; and a bubble generation module connected to the treating bath and generating bubbles in the substrate treating solution by injecting gas.
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