MULTILAYER ELECTRONIC COMPONENT
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United States of America Patent
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Issued Date -
Jun 20, 2024
app pub date -
Dec 1, 2023
filing date -
Dec 1, 2023
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Abstract
The present disclosure provides a multilayer electronic component which may improve a break down voltage (BDV) characteristic by adjusting a ratio of a content of an element included in a first or second region of a dielectric layer to reduce a difference in dielectric grain size dispersion and grain density in the first or second region.
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