COPPER ALLOY SHEET MATERIAL AND METHOD FOR PRODUCING THE COPPER ALLOY SHEET MATERIAL

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United States of America Patent

APP PUB NO 20240200169A1
SERIAL NO

18554884

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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There is provided a copper alloy sheet material, containing: 0.0005% by mass or more and 0.1% by mass or less of Ni, 0.0005% by mass or more and 0.1% by mass or less of Sn, 100 ppm or less of C, 800 ppm or less of O, 10 ppm or less of H, and 50 ppm or less of Ag, with a balance being Cu and impurities, wherein a total content of Ni and Sn is 0.001% by mass or more and 0.11% by mass or less, and when a content of the impurities is expressed as A to B (ppm) in consideration of a quantitative lower limit of each element (here, A is a total impurity content when a content of elements less than the quantitative lower limit is deemed 0 ppm, and B is a total impurity content when a content of the element less than the quantitative lower limit is deemed the quantitative lower limit of each element), A is 100 or less and B is 250 or less.

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Patent Owner(s)

Patent OwnerAddress
DOWA METALTECH CO LTDTOKYO JAPAN TOKYO METROPOLIS

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
AOYAMA, Tomotsugu Tokyo, JP 11 32
KAWAKAMI, Tomohiro Tokyo, JP 18 83
MIYAHARA, Ryosuke Tokyo, JP 5 12
NARIEDA, Hiroto Tokyo, JP 29 84
SASAI, Yuta Tokyo, JP 6 1

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