ENGINEERED MATERIALS FOR ELECTRONICS ASSEMBLY
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United States of America Patent
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Issued Date -
Jun 20, 2024
app pub date -
Apr 14, 2022
filing date -
Apr 14, 2022
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Abstract
A solder material for use in electronic assembly, the solder material comprising: solder layers; and a core layer comprising a core material, the core layer being sandwiched between the solder layers, wherein: the thermal conductivity of the core material is greater than the thermal conductivity of the solder.
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