PLATED METAL BONDING METHOD AND PLATED METAL BONDING APPARATUS
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United States of America Patent
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Issued Date -
Jun 20, 2024
app pub date -
Feb 29, 2024
filing date -
Feb 29, 2024
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Abstract
A stable bonding processing for metal, of which at least a part is plated, is provided. A plated metal bonding apparatus performs bonding of a first metal and a second metal. At least one from among the first metal and the second metal has a plated bonding portion where the bonding processing is to be performed. A bonding processing unit performs bonding of the first metal and the second metal using sound vibration and/or ultrasound vibration. The bonding processing unit performs the bonding processing using a plated material or otherwise using a metal portion in a state in which a plating material has been removed.
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