PRINTED CIRCUIT BOARD
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United States of America Patent
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Issued Date -
Jun 13, 2024
app pub date -
Jun 12, 2023
filing date -
Dec 9, 2022
priority date (Note) -
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status (Latency Note)
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Abstract
A printed circuit board includes a first insulating layer; a connection via penetrating through at least a portion of the first insulating layer and having an upper surface exposed to an upper surface of the first insulating layer; a cavity penetrating through at least a portion of the first insulating layer and having the upper surface of the first insulating layer as a bottom surface of the cavity; a bridge disposed in the cavity and having a first bridge pad disposed on a lower side of the bridge; and a bonding layer including conductive particles connected to the connection via and the first bridge pad.
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