COOLING OF ULTRASOUND ENERGIZERS MOUNTED ON PRINTED CIRCUIT BOARDS
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United States of America Patent
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Issued Date -
Jun 13, 2024
app pub date -
Feb 12, 2024
filing date -
Dec 31, 2020
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Abstract
An assembly including:
- a printed circuit board (PCB) having a first surface and a second surface;at least one energy transmitter mounted on the first surface;at least one cooling element associated with the PCB second surface, wherein the cooling element is configured to cool the at least one energy transmitter via the PCB.
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