SEMICONDUCTOR PACKAGE
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United States of America Patent
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Issued Date -
Jun 13, 2024
app pub date -
Sep 29, 2023
filing date -
Dec 9, 2022
priority date (Note) -
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Abstract
A semiconductor package includes a substrate, first bumps, a first chip, metal pillars, second bumps and a second chip. The substrate includes first and second conductive pads which are located on a top surface of the substrate. Both ends of the first bumps are connected to the first conductive pads and the first chip, respectively. Both ends of the metal pillars are connected to the second conductive pads and one end of the second bumps, respectively. A cross-sectional area of each of the metal pillars is larger than that of each of the second bumps. The second chip is connected to the other end of the second bumps and located above the first chip.
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